Bytronic and FLIR are exhibiting at Packaging Innovations 2020
We are pleased to announce that Bytronic Automation and FLIR will be co-exhibiting at Packaging Innovations 2020, located at the NEC in Birmingham, UK on February 26 & 27.
We will be demonstrating our innovative HotSpot™ solution and our engineers will be available to talk you through our complete product range in detail.
Bytronic’s flagship HotSpot product was shortlisted for 2 prestigious industry awards in 2019– for Innovative Vision Solution at the PPMA Awards and Innovation & Design at the TMMX Awards.
You can find us and check out HotSpot™ on stand H11. We hope to see you there!